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080820s2008####ja#####f######101#0#eng#d |
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20080821105307.0 |
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BCCAB014642 |
| 003 |
AR-BCCAB |
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|a International conference on solid state devices and materials :
|b Tsukuba, Japan, September 19-21, 2007 /
|c editors Yasuo Takahashi, Masaaki Kuzuhara.
|
| 260 |
# |
# |
|a Tokyo :
|b Japan Society of Applied Physics,
|c 2008.
|
| 300 |
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|a 2345-3309 ;
|c 30 cm.
|
| 490 |
1 |
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|a Japanese Journal of Applied Physics,
|x 0021-4922 ;
|v v. 47, no. 4
|
| 504 |
# |
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|a Incluye referencias bibliográficas.
|
| 111 |
2 |
# |
|a 2007 International Conference on Solid State Devices and Materials
|n (SSDM2007 :
|d 2007 :
|c Tsukuba, Japan)
|
| 650 |
# |
7 |
|a Semiconductor materials
|v Congresses.
|2 inist
|
| 650 |
# |
7 |
|a Shielding materials
|v Congresses.
|2 inist
|
| 650 |
# |
7 |
|a Materiales de blindaje
|v Congresos.
|2 inist
|
| 650 |
# |
7 |
|a Materiales semiconductores
|v Congresos.
|2 inist
|
| 700 |
1 |
# |
|a Takahashi, Yasuo,
|e ed.
|4 edt
|
| 700 |
1 |
# |
|a Kuzuhara, Masaaki,
|e ed.
|4 edt
|
| 040 |
# |
# |
|a arbccab
|b spa
|
| 500 |
# |
# |
|a "Special issue".
|
| 942 |
# |
# |
|c BK
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| 952 |
# |
# |
|2 udc
|7 NOT_LOAN
|a ARBCCAB
|b ARBCCAB
|i 014642_nuevo-0
|o JPN. J. APPL. PHYS. 2008
|p 014642_nuevo-0
|t 1
|y BK
|
